Before the printed circuit board is the interconnection between electronic components are relying on wire directly connected to form a complete circuit. In modern times, the circuit panel just as effective experimental tool exists, and printed circuit boards in the electronics industry has become to occupy the position of absolute rule.
Early 20th century, people in order to simplify the production of electronic equipment, to reduce wiring between electronic parts, reducing production costs and other advantages, began studying ways to replace the printed wiring method. Three decades, there have been proposed to be a metallic conductor engineer for wiring on an insulating substrate. The most successful was in 1925, American Charles Ducas on an insulating substrate to print out line pattern, then plating the way for the successful establishment of the conductor wiring.
Until 1936, the Austrian Paul Eisler (Paul Eisler) in Britain published a foil technique, he uses a printed circuit board in a radio device; and in Japan, to help Miyamoto hi to spray-line method "メ Tatari ri U nn French blowing wiring method (Patent No. 119384) "Success patent. And both Paul Eisler methods and today's printed circuit board is most similar to this type of practice is called subtractive method, it is to remove unwanted metal; and Charles Ducas, Miyamoto Kinosuke approach is to add only the required wiring, called additive method. Even so, because it was the electronic parts heat, both with the use of the substrate it is difficult, not so formal as practical, but also the printed circuit technology further.
development of

Over the last decade, China's printed circuit board (Printed Circuit Board, referred PCB) manufacturing industry is developing rapidly, the total output value, total output both ranking first in the world. As electronic products with each passing day, the price war has changed the structure of the supply chain, China both industrial distribution, cost and market advantages, has become the world's most important production base of the printed circuit board.
Printed circuit board development from single to double-sided, multilayer and flexible board, and continue to develop the high-precision, high density and high reliability direction. Shrinking volume, reduce costs and improve performance, so that the printed circuit board in the future development of electronic products, remains strong vitality.
The future of the printed circuit board manufacturing technology trends in performance to high-density, high-precision, pore size, fine wire, small pitch, high reliability, multi-layered, high-speed, lightweight, thin direction.